Multiple specifications of hot press machine with precise temperature control for board factories

Hot press machine, also known as bonding machine

According to the different media used for hot pressing, it can be divided into soldering, ACF (anisotropic conductive tape), ACP (anisotropic conductive adhesive), and TBF (hot melt adhesive film). Suitable for connecting FPC (flexible circuit board), HSC (zebra paper), TAB with LCD and PCB.

Due to the trend of miniaturization in the pitch of PCB or FPC in consumer electronic products, traditional soldering processes are no longer able to meet the requirements of extremely fine hot pressing. The ACF process has gradually been applied by mobile phone designers.

Characteristics of hot press machine

1. Using pulse heating technology, temperature control is precise, with a temperature sampling frequency of 0.1s

2. Diversified work modes such as single work platform, rotating work platform, and left and right mobile platform.

3. Multi stage temperature control.

4. Real time temperature curve display.

5. Silicon tape indexing mechanism.

6. CCD vision system provides precise alignment.

7. Large capacity program pre storage.

8. Touch control interface, program password protection

Working principle of hot press machine

Pulse heating principle, due to the special design of the welding head surface, the resistance of the welding surface is very small, and the current will pass through the section with the smallest resistance. By continuously changing the voltage, adjusting the current level, and using the soldering head to quickly generate heat.

Classification of hot press machines

Constant temperature hot press, pulse hot press, dual station hot press, dual head pulse hot press, desktop hot press, etc.